Photoelectric Sensor
Holitech vigorously develops automated production and high-end product development and innovation, makes every effort to enhance the strength of intellectual manufacturing, builds a multi-level R&D system on all fronts, rapidly lays out the frontier fields of biometrics, big data, smart cars, and smart home, and focuses on providing customers with high-precision, high-performance, high-value camera and biometric product solutions.
High Pixel Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：64 million
Chip Size：1/1.72 inch
F.No：1.89
Field of View：D 80°
Module Size：11.35*11.9*6.63mm
Applications：Smart Phones/Tablets Rear Main Camera
Big Pixel Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：2 million
Chip Size：1/5 inch
Pixel Size：1.75um
F.No：2.4
Field of View：D 88.8°
Module Size：5.7*6.0*3.15mm
Applications：Smart Phones/Tablets Secondary Camera DOF
Zoom Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：8 million
Chip Size：1/4.4 inch
F.No：3.4
Field of View：D 19.6°
Module Size：13.25*20.67*5.63mm
Applications：Smart Phones Secondary Camera 5x Optical Zoom
Wide Angle Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：5 million
Chip Size：1/5 inch
F.No：2.2
Field of View：D 120°
Module Size：6.5*6.5*4.48mm
Applications：Smart Phones/Tablets Secondary Camera Wide Angle Application
3D TOF Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：80 thousand
Chip Size：1/3 inch
F.No：1.3
Field of View：D 87.8°
VCSEL Field of View： 60°
Depth Accuracy：1% or less
Module Size：9.5*21.0*6.35mm
Applications：Smart Phones/Tablets Secondary Camera 3D Distance Measurement, Smart Locks
Ultra-macro Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：2 million
Chip Size：1/5 inch
F.No：2.4
Field of View：D 85°
Focusing Distance：4cm
Module Size：6.02*6.06*2.725mm
Applications：Smart Phones/Tablets Secondary Camera Ultra-macro
Metalens Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：3 hundred thousand
Chip Size：1/7.5 inch
F.No：2.0
Field of View：D 90°
Module Size：7.3*7.3*3.55mm
Applications：Smart Phones/Tablets Secondary Camera Miniaturization Module
Car recorder Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：FHD 1080P
Chip Size：1/2.9 inch
F.No：1.7
Field of View：H 123°/ V 67°
Output Format：LVDS
Module Size：25*25*28.6mm
Applications：Cars Front and Rear Camera
360 Around View Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：FHD 1080P
Chip Size：1/2.9 inch
F.No：2.0
Field of View：H 183.2°/ V 142.8°
Output Format：AHD
Module Size：25*25*23.96mm
Applications：360° Panoramic Image
Rearview Parking Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：HD 720P
Chip Size：1/3.55 inch
F.No：2.05
Field of View：H 125°/ V 82.5°
Output Format：LVDS
Module Size：23*23*26.85mm
Applications：Rearview Parking Image
Driver Monitor System Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：HD 720P
Chip Size：1/4 inch
F.No：2.5
Field of View：H 66°/ V 40°
Output Format：AHD
Module Size：76*40*29mm
Applications：940nm Infrared Driver Facial Identification Monitoring
Occupancy Monitoring System Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：HD 720P
Chip Size：1/2.9 inch
F.No：2.2
Field of View：H 139°/ V 76°
Output Format：LVDS
Module Size：50*28*29mm
Applications：In-vehicle Passenger/Living Being Identification Monitoring
ADAS Assisted Driving Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：8 million
Chip Size：1/1.73 inch
F.No：1.8
Field of View：H 124°/ V 65.6°
Output Format：LVDS
Module Size：30*30*45.8mm
Applications：Safety Assisted Driving Images
Side Blind Spot Monitoring Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：HD 720P
Chip Size：1/3.55 inch
F.No：2.05
Field of View：H 125°/ V 82.5°
Output Format：LVDS
Module Size：23*23*26.85mm
Applications：Side Blind Spot Monitoring
Intelligent Rearview Mirror Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：FHD 1080P
Chip Size：1/2.9 inch
F.No：2.0
Field of View：H 123°/ V 67°
Output Format：AHD
Module Size：25*25*26mm
Applications：Rearview Parking Monitoring Camera
XR Ultra Wide Angle Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：3 hundred thousand
Chip Size：1/7.5 inch
F.No：2.0
Field of View：D 166.5°
Module Size：6.4*6.4*5.466mm
Applications：6DOF Event Camera
XR High Pixel Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：32 million
Chip Size：1/2.8 inch
F.No：2.2
Field of View：D 159.3°
Module Size：8.85*8.85*6.5mm
Applications：Vision HD Video
3D TOF Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：80 thousand
Chip Size：1/3 inch
F.No：1.3
Field of View：D 87.8°
VCSEL Field of View：60°
Depth Accuracy：1% or less
Module Size：9.5*21.0*6.35mm
Applications：Depth Camera
Large DOF Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：1.3 million
Chip Size：1/4 inch
F.No：6.15
Field of View：D 50°
Scanning DOF：4cm~86.8cm
Module Size：6.5*6.5*6.85mm
Applications：Mobile Terminal Large Depth of Field QR Code Scanning
Autofocus Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：13 million
Chip Size：1/3 inch
F.No：2.2
Field of View：D 81.2°
Module Size：8.5*8.5*4.25mm
Applications：Mobile Terminal Auto-focus 2D Code Scanning
CCD Scanning Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Chip：ET8EH1-S-8Z（TOSHABA CCD Linear Image Sensor）
Pixels：1500
F.No：1.0
Module Size：23.7*7.5*10.44mm
Applications：Handheld Scanning Gun Linear 1D Code Scanning
HD Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：1 million
Chip Size：1/10 inch
F.No：2.2
Field of View：D 72°
Module Size：70*5.5*2.485mm
Applications：Notebook HD Video
FHD Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：2 million
Chip Size：1/5 inch
F.No：2.0
Field of View：D 82.7°
Module Size：75.8*3.1*2.375mm
Applications：Notebook UHD Video
Intelligent Medical Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：3 hundred thousand
Chip Size：1/10 inch
F.No：2.0
Focusing Distance：1.45cm
Field of View：D 85.1°
Module Size：38*φ4.1mm
Applications：Medical Endoscope
Video Conference Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：8 million
Chip Size：1/2.8 inch
F.No：2.0
Field of View：D 100.6°
Module Size：29*20*11.75mm
Applications：Video Conference
Smart Home Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：2 million
Chip Size：1/5 inch
F.No：2.2
Field of View：D 146.5°
Module Size：28*52*12mm
Applications：IoT Smart Refrigerator Application
3D Printer Camera Module
Holitech provides one-stop service for camera module R&D and manufacturing, with products involving CSP, COB, Flipchip and other processes. These products can be customized and developed according to customer requirements. Its products are widely used in smart phones, AR/VR, smart cars, smart home, industrial control scans, NoteBook and other fields.
Pixels：1 million
Chip Size：1/4 inch
F.No：1.8
Field of View：D 100°
Module Size：36*36*10mm
Applications：3D Printer
